Qualcomm introduces the second generation of the 3D Sonic sensor

Qualcomm introduces the second generation of the 3D Sonic sensor

Announced a company Qualcomm announced the second generation of the 3D Sonic sensor, which is the latest version of the ultrasonic fingerprint sensor built under the screen that seeks to improve the original model in almost every way.

The new version provides more sensor surface area and faster processing to unlock phones faster.

The second-generation 3D Sonic sensor measures up to 8 x 8 mm, compared to the 4 x 9 mm surface area of ​​the first-generation model, which means 77 percent more surface area.

This, in turn, means that it will be easier to place your finger precisely on the sensor, and allow the sensor to collect more data with each scan.

By combining a larger sensor with faster processing, Qualcomm promises that a fingerprint scan to unlock the phone will be 50 percent faster using the second-generation 3D Sonic sensor.

The first-generation ultrasound sensor from Qualcomm appeared for the first time in the Galaxy S10 range in 2018.

Almost every other reader integrated under the screen at the time used a scanner, and it was said to be slower and less reliable than the new ultrasound fingerprint reader.

The reality turned out to be the opposite, however, as the first-generation 3D Sonic sensor faced many issues, including a security flaw that caused the fingerprint reader to unlock phones with almost any fingerprint when used with some screen protectors.

Samsung later fixed the issue with a software update, and the company recently released another patch for the Galaxy Note 20 range, to address similar issues with the screen protector.

The new sensor is technically the third built-in under-screen fingerprint sensor from Qualcomm, after the original 3D Sonic sensor and the 3D Sonic Max sensor launched in 2019, which was just a much larger version of the first-generation sensor, but it lacked No speed improvements.

The second-generation 3D Sonic sensor is not identical in size to the 3D Sonic Max sensor, which measures 20 x 30 mm, but the speed improvements should be sufficient to compensate for the size difference.

Qualcomm says: The first phones with the new sensor should be available in early 2021.

The company did not mention any partners or a more specific timing in its announcement, but it is worth noting that Samsung is expected to announce the latest Galaxy S21 devices on January 14.

Samsung is by far the largest customer of Qualcomm’s ultrasonic fingerprint readers, having used them in the S10, Note 10, S20 and Note 20 series over the past two years.

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